Popis
SPECIFICATIONS
Essentials
Status
Launched
# of Cores
1
Clock Speed
3 GHz
L2 Cache
512 KB
FSB Speed
800 MHz
Instruction Set
32-bit
Embedded Options Available
Yes
Lithography
130 nm
Max TDP
81.9 W
VID Voltage Range
1.25V-1.4V
Recommended Customer Price
N/A
Package Specifications
TCASE
70°C
Processing Die Size
131 mm2
# of Processing Die Transistors
55 million
Sockets Supported
PPGA478
Low Halogen Options Available
See MDDS
Advanced Technologies
Intel® Turbo Boost Technology â¡
No
Intel® Hyper-Threading Technology â¡
Yes
Intel® Virtualization Technology (VT-x) â¡
No
