Popis
SPECIFICATIONS
-
Essentials
Status
Launched
# of Cores
1
Clock Speed
1.8 GHz
L2 Cache
512 KB
FSB Speed
400 MHz
Instruction Set
32-bit
Embedded Options Available
Yes
Lithography
130 nm
Max TDP
68.1 W
VID Voltage Range
1.475V-1.525V
Recommended Customer Price
N/A
-
Package Specifications
TCASE
77°C
Processing Die Size
131 mm2
# of Processing Die Transistors
55 million
Sockets Supported
PPGA478
Low Halogen Options Available
See MDDS
-
Advanced Technologies
Intel® Turbo Boost Technology â¡
No
Intel® Virtualization Technology (VT-x) â¡
No
